Polysilicon Cleaning Applications

Eliminate Organic and Metal Contamination of Silicon Chunks, Clean Oxide Growth

The MEI Evolution PSE polysilicon chunk cleaning system is ideal for removal of organic and metallic contamination found on Si ingot chunks after crushing polysilicon rods or Si-ingots in the polysilicon manufacturing process. Cleaning or etching poly chunks requires a high throughput wet etch system with good process control and outstanding drying capabilities to achieve optimal purity.  MEI’s solution for Poly Silicon chunk etching, cleaning and drying has significant advantages inherent in the carefully thought out design that considers not only operation, but resource use, safety, maintainability, control and flexibility.

Electronic, Solar or UMG Grade Polysilicon

Flexible Process Design Supporting a Range of PolySilicon Cleaning Applications:

• Acid or Alkaline Etching
• Automated Wafer Cleaning
• Chunk oxide removal
• Wafer Saw Damage Etch
• Polysilicon and solar wafer texturing
• New process development for wet process steps
• Polysilicon Filament and Rod preparation